Blind/Buried Via

Blind/Buried Via

Via hole normaly mean hole size smaller than 0.5mm in diameter,it serves to make electrical connection between selected copper layers. on a PCB design. In PCB design,via can be classified into 3 types: through hole via, blind via and buried via. Blind/buried vias are widely applied in SMT (Surface Mount Technology) just to compensate for disadvantages of through-hole vias.

Blind via connects one external layer and one or more inner layers in printed circuit board, responsible for interconnection between top layer and inner layers or bottom layer and inner layers.

Buried vias connect only inner layers inside printed circuit board so that they are invisible just from the outer appearance of a PCB since they are internally "buried".

As blind/buried vias conform to the density improvement of boards without the need to increase number of layers or board size, they are usually applied in HDI PCBs. Put in another way, they can be picked up when you suffer from tight requirement of limited space and through-hole hassles.

Due to our over 10 years' experience in this industry, Plus Circuits specializes in manufacturing PCBs with blind/buried vias. Both engineers and manufacturing equipment in house can ensure our full capabilities in meeting the requirements of blind/buried via technology.

Plus Circuits is capable of offering mechanically drilled and laser drilled PCB. When it comes to mechanical drilling, via diameter ranges from 0.15mm to 0.5mm while 0.1mm for laser drilling.  Laser drilling is usually applied on HDI design.